- Shenzhen weikexiu technology Co.,Ltd
- China Manufacturer with main products:Universal Programmer Device ,UP-828P Programmer , IC Test Sockets and Adapter ,Soldering Tools and soldering stations ,Electronic Measurement Intruments , Remote Key Programmer ,Transponder key chips and Car ECU ICs , Phone Repair Tools ,Phone Replacement Parts ,iPhone CHIP / NAND / EEPROM error repair machine
Home > Products > BGA Soldering Station > iRepair MS1 Soldering heating Station For phone X-13Promax PCB Disassembly Tool
iRepair MS1 Soldering heating Station For phone X-13Promax PCB Disassembly Tool
- 10000000 Piece / Pieces per Month
- Hongkang Shenzhen
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- 3 days
Product Details
Brand Name: | iRepair | Place of Origin: | China | Model Number: | iRepair-MS1 |
Product Description
Mijing iRepair MS1 desoldering preheating platform For Phone X-14 Pro Max motherboard CPU IC heating disassembly and glue removal. iRepair MS1 Soldering heating Staion MS1-14 module for Phone 14/14 Plus/14 Pro/14 Pro Max.
Feature:
1. iRepair MS1 pre-heating staion for Phone X/XS/XS MAX/11/11Pro/11 Pro Max/12/12 mini/12Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max motherboard soldering separating.
2. Mijing iRepair MS1 Multi-function Desoldering Station
3. Newly upgraded heating element, fast heating, precise temperature control
4. Added countdown function, layering and fitting are more secure
5. Phone X -14 Pro Max module + universal module + dot matrix module + follow-up unlimited upgrades.
6. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Brand: Mijing iRepair
Name: iRepair MS1 Multifunctional Desoldering Station
Packing size: 220*158*50 (mm)
MS1 upgrade expansion module
Packing size: 114*79*10 (mm)
Contact Us
- Shenzhen weikexiu technology Co.,Ltd
- Contact namephonefix nicole
- Addresslonggang Shenzhen,Guangdong
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