self Adhesive Backing PU Polishing Pads Cerium Oxide

Application Of Polyurethane (PU) Polishing Pad :

Polishing And Finishing Of Glass, LCD/LED Substrates, Precision Optics, Hard Disk, Metal And Semiconductor Wafer Surfaces.

Size Of Polyurethane (PU) Polishing Pad :

Thickness For Polyurethane Polishing Pad:

Standard Thickness For PU Polishing Pads Ranges From 0.020 Inches (0.508 Mm) To 0.20 Inch (5.08 Mm)

Model	Filler	Average Density G / Cm³ (Ib / Ft³ ）	Average Hardness Shore - A	Application Area
MSH- 110	Cerium Oxide	0.42 (26)	78	Glass, Crystal, Metal, Ceramic
MSH- 120	Cerium Oxide	0.43 (27)	78	Glass, Crystal
MSH- 130	Cerium Oxide	0.35 (22)	66	Glass, Crystal
MSH- 210	Zirconium Oxide	0.59 (37)	90	Glass, Metal , Ceramic
MSH- 230	Zirconium Oxide	0.40 (25)	74	Glass, Crystal
MSH- 240	Zirconium Oxide	0.57 (36)	88	Glass, Crystal
MSH- 410	None	0.51 (32)	88	Glass, Metal , Ceramic, Crystal
MSH- 420	None	0.77 (49)	96	Glass, Metal , Ceramic, Crystal

Pressure-Sensitive Adhesives (PSA) Backing: Adhesive Backing Is Available On All Types Of Pads. PSA Backing Ranges From High-Holding To Low Tack/Easy Release.

Grooving :Grooves Improve Pad Performance By Reducing Excess Slurry From The Pads Surfaces. More Superhard Pad In Offered In A Variety Of Groove Configurations . The Depth Of A Groove Is Usually Half Of The Pad Thickness, Only Pad With Thickness Of More Than 2 Mm Can Be Grooved . Groove Width Is Usually 2 Mm, And The Island Size Is Usually 16*16 Mm.

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