Silicone Rubber Pad thermal conductive thermal interface material

Introduction

XK-R Series silicone rubber thermal gap filler is a kind of silicon rubber-based gap filling material which is highly compressed with high heat-conducting filling materials. The coefficient of heat conductivity can reach 1.0~ 3.0 W/m.K. This kind of materials is aiming at offering super heat-conducting property and maintains the cost efficiency of customers as well.

Features

Un-reinforced construction for additional compliancy

Medium compliancy and conformability

High thermal performance, cost-effective solution

Easy to USE ( 0.1~0.5mm )

Applications

Consumer electronics.

Automotive Systems.

Telecommunications.

Aerospace.

Military.

Medical devices.

Industrial controls.