BGA reflow soldering machine, solder reflow oven T962, mini wave oven,taian,puhui

Specifications

reflow soldering machine
- 800w
- 180 x 235mm soldering area
- good price, easy operate
- CE

BGA reflow soldering machine, solder reflow oven T962,

mini wave oven,taian,puhui

 

 

Technical parameters  T962  

                             

Soldering area: 180*235mm

Overall dimensions: 31*29*17cm

Packing dimensions: 37.5*24*37.5cm

Power: 800W

Cycle time: 1-8 min

Voltage: AC110V-AC220V /50-60HZ

Net weight: 6.2Kgs

Gross weight: 7.5Kgs

 

 

FEATURES

 

 

(1)  Large infrared soldering area: 180*235mm (T-962)

 

 

(2) Eight soldering waves 

 

 

(3) Special heat up and temperature equalization 

 

Big power of energy efficient Infrared heating and air circulation to re-flow solder.

 

 

(4) Ergonomic design, practical and easily operated

 

 

(5) Large number of available functions

 

Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. 

It is the ideal rework solution from single runs to on-demand small batch production.