FEP lining film/polyimide film/F46 film/FEP film

Polyimide tape  

Polyimide (PI) adhesive tape,Insulation material for tansformer.

Application: Polyimide (PI) adhesive tape, Insulation material for tansformer. This item is used for SMD packing and transformer manufacturing.

Specification: 1. Polyimide base film coating with high temperature Silicone adhesive;

             2. High temperature and corrosion resistance;

             3. Strong adhesion;

             4. Soft and proper and no residue after peeling off.

             5. For electronic manufacturing industry.

 We are one of the most professional Chinese tapes' manufacturers and leaders. 

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