Thermally conductive adhesive tape for Heat sink attachment to Ceramic or Metal components

Specifications

Thermal conductive adhesive tape
-LED thermal conductive tape
-Thermal acrylic pad
-Standard size:500mm*50M
-Industry price

HCT series is a kind of Thermally conductive adhesive tape for Heat sink attachment to Ceramic or Metal components applied in the bond between heat sink and other   power consumption semiconductor,  the adhesive  is in the nature of strong bonding strength and low thermal resistance, which can replace thermal  silicon grease  and mechanical fixation effectively . 

 

Features & benefits:

-High acrylic adhesive tape for pressure sensitive of various surfaces

-High-performance, thermally conductivity acrylic adhesive

 

Typical applications:

-Make the heat sink fixed to the encapsulated chip

-Make the radiator fixed to the power supply circuit board or the vehicle control circuit board

-Efficient thermal conductive acrylic adhesive

-Can replace the fixed mode of hot melt adhesive, screw and buckle

 

Physical properties:

Test  Item	Test  method	Unit	Test Value
Reinforcement carrier	-	-	Fiberglass
Color	Visual	-	White
Thickness	ASM D374	mm	0.1 to 0.4
Temperature Resistance	-	°C	180
Adhesion strength	ASTM D412	Kg/inch2	1.2
Breakdown voltage	ASTM D149	KV/mm	3 to 7
Initial adhesion	ASTM D1002	kg/inch	0.6 to 1.5
Thermal conductivity	ASTM D5470	W/m-k	1.5
Continuous use temp	EN 344	°C	-40 to +180

 

Configurations available: 500mm*50M, specific size could be provided according to your requirements.